Systems including memory cells on opposing sides of a pillar

ABSTRACT

Systems including a processor and a memory device in communication with the processor include an array of non-volatile memory cells configured in a NAND architecture. The array includes a plurality of series-coupled first non-volatile memory cells, each first non-volatile memory cell curving around a first curved side of a substantially vertical pillar and terminating at an isolation region, and a plurality of series-coupled second non-volatile memory cells, each second non-volatile memory cell curving around a second curved side of the substantially vertical pillar and terminating at the isolation region. Respective ones of the first non-volatile memory cells are respectively at same vertical levels as respective ones of the second non-volatile memory cells.

RELATED APPLICATIONS

-   -   This application is a continuation of U.S. application Ser. No.        15/691,794, filed Aug. 31, 2017 and issued as U.S. Pat.        10,522,55 on Dec. 31, 2019, which is a continuation of U.S.        application Ser. No. 15/246,847, filed Aug. 25, 2016 and issued        as U.S. Pat. No. 9,768,194 on Sep. 19, 2017, which is a        continuation of U.S. application Ser. No. 14/820,027, filed Aug.        6, 2015 and issued as U.S. Pat. No. 9,455,266 on Sep. 27, 2016,        which is a continuation of U.S. application Ser. No. 13/676,407,        filed Nov. 14, 2012 and issued as U.S. Pat. No. 9,147,693 on        Sep. 29, 2015, which is a continuation of U.S. application Ser.        No. 13/047,215, filed Mar. 14, 2011 and issued as U.S. Pat. No.        8,329,513 on Dec. 11, 2012, which is a divisional of U.S.        application Ser. No. 12/047,414, filed Mar. 13, 2008 and issued        as U.S. Pat. No. 7,906,818 on Mar. 15, 2011, all of which        applications are commonly assigned and incorporated entirely        herein by reference.

FIELD

The present disclosure relates generally to memory arrays and inparticular at least one embodiment of the present disclosure relates toa memory array with a pair of memory-cell strings to a single conductivepillar.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic devices. There aremany different types of memory including random-access memory (RAM),read only memory (ROM), dynamic random access memory (DRAM), synchronousdynamic random access memory (SDRAM), and flash memory.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications.Non-volatile memory is memory that can retain its data values for someextended period without the application of power. Flash memory devicestypically use a one-transistor memory cell that allows for high memorydensities, high reliability, and low power consumption. Changes inthreshold voltage of the cells, through programming of charge storagenodes, such as floating gates or trapping layers or other physicalphenomena, determine the data value of each cell. By defining two ormore ranges of threshold voltages to correspond to individual datavalues, one or more bits of information may be stored on each cell.Common uses for flash memory and other non-volatile memory includepersonal computers, personal digital assistants (PDAs), digital cameras,digital media players, digital recorders, games, appliances, vehicles,wireless devices, mobile telephones and removable memory modules, andthe uses for non-volatile memory continue to expand.

Flash memory typically utilizes one of two basic architectures known asNOR flash and NAND flash. The designation is derived from the logic usedto read the devices. In NOR flash architecture, a column of memory cellsare coupled in parallel with each memory cell coupled to a bit line. InNAND flash architecture, a column of memory cells are coupled in serieswith only the first memory cell of the column coupled to a bit line.

One common type of flash memory is a nitride read only memory (NROM),sometimes referred to as semiconductor-oxide-nitride-oxide-semiconductor(SONOS) memory. Such devices generally include silicon nitride (Si₃N₄)as a charge-trapping node, although other dielectric materials may beutilized. By accumulating charge in, or discharging, the charge-trappingnode within a memory cell, the threshold voltage of that memory cell maybe altered.

In order for memory manufacturers to remain competitive, memorydesigners are constantly trying to increase the density of memorydevices. Increasing the density of a flash memory device generallyrequires reducing spacing between memory cells and/or making memorycells smaller. Smaller dimensions of many device elements may causeoperational problems with the cell. For example, the channel between thesource/drain regions becomes shorter, possibly causing severe shortchannel effects.

One way of increasing the density of memory devices is to formmulti-layered memory arrays, e.g., often referred to asthree-dimensional memory arrays. For example, one type ofthree-dimensional memory array includes a plurality of horizontal layersof traditional two-dimensional arrays, such as NAND or NOR memoryarrays, stacked vertically one atop the other, with the memory cells ofeach memory array being silicon-on-sapphire transistors,silicon-on-insulator transistors, thin film transistors, thermoelectricpolymer transistors, semiconductor-oxide-nitride-oxide-semiconductortransistors, etc. Another type of three-dimensional memory arrayincludes pillars of stacked memory elements, such as vertical NANDstrings that pass vertically through multi-stacked layers of electrodematerial, where each memory element is asemiconductor-oxide-nitride-oxide-semiconductor transistor, for example.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art foralternative three-dimensional memory arrays.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of an embodiment of a NAND flashmemory device, according to an embodiment of the disclosure.

FIGS. 2A-2C are cross-sectional views of a portion of a memory array atvarious stages of fabrication in accordance with another embodiment ofthe disclosure.

FIG. 3 is an enlarged view of region 300 of FIG. 2B, according toanother embodiment of the disclosure.

FIG. 4 is a top view of the structure of FIG. 2B, according to anotherembodiment of the disclosure.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, and in which is shown, byway of illustration, specific embodiments. In the drawings, likenumerals describe substantially similar components throughout theseveral views. Other embodiments may be utilized and structural,logical, and electrical changes may be made without departing from thescope of the present disclosure. Use the following if applicable: Theterm wafer or substrate used in the following description includes anybase semiconductor structure. Both are to be understood as includingsilicon-on-sapphire (SOS) technology, silicon-on-insulator (SOI)technology, thin film transistor (TFT) technology, doped and undopedsemiconductors, epitaxial layers of a silicon supported by a basesemiconductor structure, as well as other semiconductor structures wellknown to one skilled in the art. Furthermore, when reference is made toa wafer or substrate in the following description, previous processsteps may have been utilized to form regions/junctions in the basesemiconductor structure, and terms wafer or substrate include theunderlying layers containing such regions/junctions. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present disclosure is defined only by the appendedclaims and equivalents thereof.

FIG. 1 is a simplified block diagram of a NAND flash memory device 100in communication with a processor 130 as part of an electronic system,according to an embodiment. The processor 130 may be a memory controlleror other external host device. Memory device 100 includes an array ofmemory cells 104 formed in accordance with embodiments of thedisclosure. A row decoder 108 and a column decoder 110 are provided todecode address signals. Address signals are received and decoded toaccess memory array 104.

Memory device 100 also includes input/output (I/O) control circuitry 112to manage input of commands, addresses and data to the memory device 100as well as output of data and status information from the memory device100. An address register 114 is in communication with I/O controlcircuitry 112, and row decoder 108 and column decoder 110 to latch theaddress signals prior to decoding. A command register 124 is incommunication with I/O control circuitry 112 and control logic 116 tolatch incoming commands. Control logic 116 controls access to the memoryarray 104 in response to the commands and generates status informationfor the external processor 130. The control logic 116 is incommunication with row decoder 108 and column decoder 110 to control therow decoder 108 and column decoder 110 in response to the addresses.

Control logic 116 is also in communication with a cache register 118.Cache register 118 latches data, either incoming or outgoing, asdirected by control logic 116 to temporarily store data while the memoryarray 104 is busy writing or reading, respectively, other data. For oneembodiment, control logic 116 may include one or more circuits adaptedto produce a particular and predictable outcome or set of outcomes inresponse to one or more input events. During a write operation, data ispassed from the cache register 118 to data register 120 for transfer tothe memory array 104; then new data is latched in the cache register 118from the I/O control circuitry 112. During a read operation, data ispassed from the cache register 118 to the I/O control circuitry 112 foroutput to the external processor 130; then new data is passed from thedata register 120 to the cache register 118. A status register 122 is incommunication with I/O control circuitry 112 and control logic 116 tolatch the status information for output to the processor 130.

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals may includeat least chip enable CE #, a command latch enable CLE, an address latchenable ALE, and a write enable WE #. Memory device 100 receives commandsignals (which represent commands), address signals (which representaddresses), and data signals (which represent data) from processor 130over a multiplexed input/output (I/O) bus 134 and outputs data toprocessor 130 over I/O bus 134.

For example, the commands are received over input/output (I/O) pins[7:0] of I/O bus 134 at I/O control circuitry 112 and are written intocommand register 124. The addresses are received over input/output (I/O)pins [7:0] of bus 134 at I/O control circuitry 112 and are written intoaddress register 114. The data are received over input/output (I/O) pins[7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bitdevice at I/O control circuitry 112 and are written into cache register118. The data are subsequently written into data register 120 forprogramming memory array 104. For another embodiment, cache register 118may be omitted, and the data are written directly into data register120. Data are also output over input/output (I/O) pins [7:0] for an8-bit device or input/output (I/O pins [15:0] for a 16-bit device.

It will be appreciated by those skilled in the art that additionalcircuitry and signals can be provided, and that the memory device ofFIG. 1 has been simplified. It should be recognized that thefunctionality of the various block components described with referenceto FIG. 1 may not be segregated to distinct components or componentportions of an integrated circuit device. For example, a singlecomponent or component portion of an integrated circuit device could beadapted to perform the functionality of more than one block component ofFIG. 1. Alternatively, one or more components or component portions ofan integrated circuit device could be combined to perform thefunctionality of a single block component of FIG. 1.

Additionally, while specific I/O pins are described in accordance withpopular conventions for receipt and output of the various signals, it isnoted that other combinations or numbers of I/O pins may be used in thevarious embodiments.

FIGS. 2A-2C are cross sectional views of a portion of a memory array,such as memory array 104 of FIG. 1, during various stages offabrication, according to an embodiment. FIG. 2A shows a cross-sectionof a source-select-gate portion 201 of the memory array after severalprocessing steps have been performed. In general, the formation of thestructure of FIG. 2A may include forming a dielectric layer 202overlying a semiconductor substrate 200, such as a silicon-containingsubstrate, e.g., a P-type monocrystalline silicon substrate, as shown inFIG. 2A. For one embodiment, semiconductor substrate 200 forms a sourceline 200 of the memory array. Dielectric layer 202 may be anoxide-nitride-oxide (ONO) layer, with a first oxide layer in contactwith source line 200, the nitride layer overlying and in contact withthe first oxide layer, and a second oxide layer overlying and in contactwith the nitride layer.

A conductive layer 204 is formed overlying dielectric layer 202.Conductive layer 204 may be of polysilicon, such as conductively dopedP-type polysilicon, as shown in FIG. 2A. Alternatively, conductive layer204 may be a metal-containing layer, such as a refractory metal silicidelayer. The metals of chromium (Cr), cobalt (Co), hafnium (Hf),molybdenum (Mo), niobium (Nb), tantalum (Ta), titanium (Ti), tungsten(W), vanadium (V) and zirconium (Zr) are generally recognized asrefractory metals.

A dielectric layer 206, such as a pad oxide layer, e.g., a thermal oxidelayer or a deposited silicon dioxide (SiO₂) layer, is formed overlyingconductive layer 204. A cap 208, such as a nitride cap, e.g., of siliconnitride, is formed overlying dielectric layer 206.

After forming cap 208, holes 210 are formed passing through cap 208,dielectric layer 206, conductive layer 204, and dielectric layer 202,stopping substantially on source line 200. Holes 210 may be formed bypatterning cap layer 208 and removing portions of cap layer 208,dielectric layer 206, conductive layer 204, and dielectric layer 202corresponding to the holes 210 exposed by the patterned cap layer 208 byetching, for example. Note that each of holes 210 exposes an edge of caplayer 208, dielectric layer 206, conductive layer cap layer 204, anddielectric layer 202 and portion of source line 200. Each of holes 210is then lined with a dielectric layer 212, such as an oxide layer, e.g.,using low pressure chemical vapor deposition (LPCVD). For example,dielectric layer 212 is formed on the exposed edges of cap 208,dielectric layer 206, conductive layer 204, and dielectric layer 202.The remaining portion of each of holes 210 is then filled with aconductive layer, e.g., a conductive pillar, such as a plug, 214, e.g.,of polysilicon, that overlies dielectric layer 212.

For one embodiment, conductive pillar 214 is conductively doped to an n⁻conductivity type. Then, for example, ion implantation at a first powersetting may be used to convert a portion of conductive pillar 214 at thelevel of dielectric layer 202 to an n⁺ conductivity type, as shown inFIG. 2A. Ion implantation at a second power setting may be used toconvert a portion of conductive pillar 214 at the level of cap layer 208to an n⁺ conductivity type, for example, as shown in FIG. 2A.

A source select transistor 216, such as a field effect transistor (FET),is formed at each intersection of a conductive pillar 214 and conductivelayer 204, where conductive layer 204, dielectric layer 212, andconductive pillar 214 respectively form the control gate (which can alsobe referred to as a select gate), gate dielectric, and channel, of eachselect transistor 216. In other words, each source select transistor 216has a gate dielectric 212 on a conductive pillar 214 and a select gate204 on the gate dielectric 212. Each select gate 204 forms a portion ofa source select line extending substantially perpendicularly into theplane of FIG. 2A (not shown).

In FIG. 2B, a memory cell portion 220 of the memory array is formedoverlying the source-select-gate portion 201 of FIG. 2A. Memory cellportion 220 may be formed by forming a dielectric layer 222, e.g.,dielectric layer 222 ₁, such as a pad oxide layer, e.g., a thermal oxidelayer or a deposited silicon dioxide (SiO₂) layer, overlying cap layer208. A conductive layer 224, e.g., conductive layer 224 ₁, is formedoverlying dielectric layer 222 ₁. Conductive layer 224 may be ofpolysilicon, such as conductively doped P-type polysilicon.Alternatively, conductive layer 224 may be a metal-containing layer,such as a refractory metal silicide layer. Another dielectric layer 222,e.g., dielectric layer 222 ₂, is formed overlying conductive layer 224₁, and another conductive layer 224, e.g., conductive layer 224 ₂, isformed overlying dielectric layer 222 ₂, as shown in FIG. 2B. For oneembodiment, dielectric layers 222 and conductive layers 224 mayalternate, as shown in FIG. 2B, until memory cell portion 220 includesup to a certain number, e.g., N, where N is generally some power of two,such as 8, 16, 32, 64, etc., of alternating dielectric layers 222 andconductive layers 224 overlying source-select-gate portion 201.

Holes 226 are formed passing through dielectric layers 222 andconductive layers 224, stopping substantially on an upper surface ofsource-select-gate portion 201 so that holes 226 are substantiallyaligned with conductive pillars 214, as shown in FIG. 2B. For example,holes 226 may stop at an upper surface of conductive pillars 214. Holes226 may be formed by patterning the uppermost conductive layer 224,e.g., conductive layer 224 ₂ in FIG. 2B, and removing portions ofdielectric layers 222 and conductive layers 224 corresponding to theholes 226 exposed by the patterned conductive layer 224 by etching, forexample. Note that each of holes 226 exposes an edge of each dielectriclayer 222 and each conductive layer 224 and an upper surface of aconductive pillar 214.

Each of holes 226 may be lined with a charge trapping layer 228, e.g.,using low pressure chemical vapor deposition (LPCVD). For example,charge trapping layer 228 is formed on the exposed edges of eachconductive layer 224 and each dielectric layer 222. The remainingportion of each of holes 226 is then filled with a conductive layer,e.g., a conductive pillar, such as a plug, 230, e.g., of polysilicon,that overlies charge trapping layer 228 so that each conductive pillar230 contacts a respective one of conductive pillars 214, as shown inFIG. 2B.

FIG. 3 is an enlarged view of region 300 of FIG. 2B, illustrating thestructure of charge trapping layer 228, according to another embodiment.For one embodiment, conductive pillar 230, charge trapping layer 228,and conductive layer 224 form asemiconductor-oxide-nitride-oxide-semiconductor (SONOS) structure. Forexample, charge trapping layer 228 may include an oxide layer 232 formedon conductive layer 224, a nitride layer 234 formed on oxide layer 232,and an oxide layer 236 formed on nitride layer 234, as shown in FIG. 3.Therefore, lining each hole 226 includes forming oxide layer 232 on thesidewalls of each hole 226, e.g., using LPCVD, forming nitride layer 234on oxide layer 232, e.g., using LPCVD, and forming oxide layer 236 onnitride layer 234, e.g., using LPCVD. Conductive pillar 230 is thenformed on oxide layer 236 so as to fill the remainder of each hole 226.

FIG. 4 is a top view of the structure of FIG. 2B. In other words, FIG.2B is a cross-section viewed along line 2B-2B of FIG. 4. For oneembodiment, slots 410 are formed passing through dielectric layers 222and conductive layers 224 in a direction substantially parallel to holes226, stopping substantially on the upper surface of source-select-gateportion 201 so that slots 410 extend to substantially the same levelbelow the upper surface of memory cell portion 220 as do holes 226. Forexample, slots 410 stop at an upper surface of conductive pillars 214and an upper surface of cap layer 208. Each slot 410 is then filled witha dielectric material 415, such as a high-density-plasma (HDP) oxide,spin-on dielectric material, e.g., hydrogen silsesquioxane (HSQ),hexamethyldisiloxane, octamethyltrisiloxane, etc., to form an isolationregion 420

Isolation regions 420 cut each conductive layer 224 into electricallyisolated activation lines, such as word lines, 424, as shown in FIGS. 2Band 4, that extend substantially perpendicularly into the plane of FIG.2B. For example, isolation regions 420 divide conductive layer 2242 intoa plurality of isolated word lines 424 _(2,1), 424 _(2,2), 424 _(2,3),and 424 _(2,4). Each isolation region 420 extends between conductivepillars 230 in a direction transverse to the depth of that isolationregion 420, e.g., in a direction substantially parallel to the word-linedirection indicated by arrows 430.

Each isolation region 420 cuts through at least a portion of the chargetrapping layers 228 overlying the conductive pillars 230 between whichthat isolation region 420 extends so that the each charge trapping layer228 is not contiguous in a direction around a perimeter of therespective one of the filled holes 226, as shown in FIG. 4. Eachisolation region 420 forms a pair of charge traps 229 from each of thecharge trapping layers 228, with a charge trap 229 interposed between aside of a conductive pillar 230 and a word line 424, as shown in FIGS.2B and 4. For example, an isolation region 420 may cut through oxidelayer 232, nitride layer 234, and oxide layer 236, as shown in FIG. 4.Alternatively, an isolation region 420 may cut through oxide layer 232and nitride layer 234 of a charge trap 228. Although holes 226 are shownto have circular cross-sections in FIG. 4, holes 226 may have oval orsubstantially square or rectangular cross-sections or the like.

Cutting a charge trapping layer 228 with an isolation region 420 forms apair of isolated memory cells 450 _(1,2), 450 _(2,2), with memory cell450 _(1,2) occurring at an intersection between a first side of a pillar230 and word line 424 _(2,2,) and memory cell 450 _(2,2) occurring at anintersection between a second side, opposite the first side, of thatpillar 230 and word line 424 _(2,3), as shown in FIGS. 2B and 4. At eachintersection between a side of a conductive pillar and a word line 424,the word line forms a control gate of the memory cell 450 at thatintersection. As shown in FIG. 2B, memory cells 450 _(1,1) and 450_(1,2) are respectively formed at the intersection of a first side of apillar 230 and word lines 424 _(1,2) and 424 _(2,2) form a firstserially-coupled string, e.g., a first NAND string, of memory cells onthe first side of that pillar 230, and memory cells 450 _(2,1) and 450_(2,2) are respectively formed at the intersection of the second side ofthat pillar 230 and word lines 424 _(1,3) and 424 _(2,3) form a secondserially-coupled string, e.g., a second NAND string, of memory cells onthe second side of that pillar 230. Alternatively, memory cells of aserially-coupled string may alternate on opposing sides of a pillar 230.For example, memory cells 450 _(1,1) and 450 _(2,2) respectively formedat the intersection of a first side of a pillar 230 and word line 424_(1,2) and at the intersection of a second side of that pillar 230 andword line 424 _(2,3) may form a first serially-coupled string, e.g., afirst NAND string, of memory cells on alternating sides of that pillar230, and memory cells 450 _(2,1) and 450 _(1,2) respectively formed atthe intersection of the second side of that pillar 230 and word lines424 _(1,3) and at the intersection of the first side of that pillar 230and word line 424 _(2,3) may form a second serially-coupled string,e.g., a second NAND string, of memory cells on alternating sides of thatpillar 230. For one embodiment, each memory cell 450 may be anon-volatile SONOS flash memory cell that includes a portion of a wordline 424 that forms a control gate of the memory cell 450, a charge trap228, including an oxide layer 232 formed on the word line 424, a nitridelayer 234 formed on the oxide layer 232, an oxide layer 236 formed onthe nitride layer 234, and a portion of a conductive pillar 230 formedon the oxide layer 236.

In FIG. 2C, a drain-select-gate portion 250 of the memory array isformed overlying the memory cell portion 220 of FIG. 2B, according to anembodiment. Drain-select-gate portion 250 may be formed by forming adielectric layer 252, such as a pad oxide layer, e.g., a thermal oxidelayer or a deposited silicon dioxide (SiO₂) layer, overlying theuppermost word lines 424, e.g., word lines 424 _(2,1), 424 _(2,2), 424_(2,3), and 424 _(2,4), the isolation region 420 between the uppermostword lines 424, and conductive pillars 230, as shown in FIG. 2C.

A dielectric layer 254, such as a nitride layer, e.g., a layer ofsilicon nitride, is formed overlying dielectric layer 252. A dielectriclayer 256, e.g., similar to dielectric layer 252, is formed overlyingdielectric layer 254. A conductive layer 258, e.g., similar toconductive layer 204 as described above in conjunction with FIG. 2A, isformed overlying dielectric layer 256. A dielectric layer 260, e.g.,similar to dielectric layer 252, is formed overlying conductive layer258. A dielectric layer 262, e.g., similar to dielectric layer 254, isformed overlying dielectric layer 260. A dielectric layer 264, e.g.,similar to dielectric layer 252, is formed overlying dielectric layer262.

After forming dielectric layer 264, holes 266 are formed passing throughdielectric layer 264, dielectric layer 262, dielectric layer 260,conductive layer 258, dielectric layer 254, and dielectric layer 252,e.g., stopping substantially on conductive pillars 230. For exampleholes 266 may be aligned with conductive pillars 230, as shown in FIG.2C. Holes 266 may be formed by patterning dielectric layer 264 andremoving portions of dielectric layer 264, dielectric layer 262,dielectric layer 260, conductive layer 258, dielectric layer 256,dielectric layer 254, and dielectric layer 252 corresponding to theholes 266 exposed by the patterned dielectric layer 264 by etching, forexample. Note that each of holes 266 exposes an edge of dielectric layer264, dielectric layer 262, dielectric layer 260, conductive layer 258,dielectric layer 254, and dielectric layer 252 and an upper surface of aconductive pillar 230. Each of holes 266 is then lined with a dielectriclayer 268, such as an oxide layer, e.g., using low pressure chemicalvapor deposition (LPCVD). For example, dielectric layer 268 is formed onthe exposed edges of dielectric layer 264, dielectric layer 262,dielectric layer 260, conductive layer 258, dielectric layer 254, anddielectric layer 252. The remaining portion of each of holes 266 is thenfilled with a conductive layer, e.g., a conductive pillar, such as aplug, 270, e.g., of polysilicon, that overlies dielectric layer 268.

For one embodiment, conductive pillar 270 is conductively doped to an n⁻conductivity type. Then, for example, ion implantation at a first powersetting may be used to convert a portion of conductive pillar 270 at thelevel of dielectric layers 252, 254, and 256 to an n⁺ conductivity type,as shown in FIG. 2C. Ion implantation at a second power setting may beused to convert a portion of conductive pillar 270 at the level ofdielectric layers 260, 262, and 264 to an n⁺ conductivity type, forexample, as shown in FIG. 2C.

For one embodiment, trenches 274 are formed passing through dielectriclayer 264, dielectric layer 262, dielectric layer 260, conductive layer258, dielectric layer 256, dielectric layer 254, and dielectric layer252, stopping substantially on the uppermost word lines 424, e.g., wordlines 424 _(2,1), 424 _(2,2), 424 _(2,3), and 424 _(2,4) of FIG. 2C.Trenches 274 may be formed by patterning dielectric layer 264 andremoving portions of dielectric layer 264, dielectric layer 262,dielectric layer 260, conductive layer 258, dielectric layer 256,dielectric layer 254, and dielectric layer 252 corresponding to thetrenches 274 exposed by the patterned dielectric layer 264 by etching,for example. Each trench 274 is then filled with a dielectric material276, such as a high-density-plasma (HDP) oxide, spin-on dielectricmaterial, e.g., hydrogen silsesquioxane (HSQ), hexamethyldisiloxane,octamethyltrisiloxane, etc., to form isolation regions 278. Isolationregions 278 define a control gate, such as a select gate 279, at eachintersection of the remaining portions of conductive layer 258 and aconductive pillar 270, as shown in FIG. 2C.

A drain select transistor 280, such as a field effect transistor (FET),is formed at each intersection of a conductive pillar 270 and conductivelayer 258, where conductive layer 258, dielectric layer 268, andconductive pillar 270 respectively form the select gate, gatedielectric, and channel, of each drain select transistor 280. In otherwords, each drain select transistor 280 has a gate dielectric 268 on aconductive pillar 270 and a select gate 279 on the gate dielectric 268.Each select gate 279 forms a portion of a drain select line 282,indicated by a dashed line in FIG. 4. Each drain select line 282overlies and is substantially parallel to a dielectric-filled slot 410,as shown in FIG. 4.

A conductive layer 286, e.g., a metal layer, such as aluminum, is formedoverlying an upper surface of each isolation region 278, an uppersurface of dielectric layer 264, and an upper surface of each conductivepillar 270, as shown in FIG. 2C. Conductive layer 286 is patterned,etched, and processed, e.g., using standard processing, to produceindividual data lines, such as bit lines 290, shown as dashed lines inFIG. 4, therefrom. Bit lines 290 are substantially orthogonal to selectlines 282 and dielectric-filled slots 410, as shown in FIG. 4.

Note that the memory cells 450 on each side of a conductive pillar 230and dielectric-filled slot 410 (FIG. 4) form a serially-coupled stringof memory cells 450 interposed between a source select transistor 216and a drain select transistor 280. For example, FIG. 2C shows aserially-coupled string of memory cells 450 _(1,1) and 450 _(1,2)located on one side of a conductive pillar 230 and interposed betweensource select transistor 216 and a drain select transistor 280, and aserially-coupled string of memory cells 450 _(2,1) and 450 _(2,2),located on the opposite side of that conductive pillar 230 andinterposed between source select transistor 216 and a drain selecttransistor 280. The common pillar 230 couples the memory cells 450_(1,1) and 450 _(1,2) in series and the memory cells 450 _(2,1) and 450_(2,2) in series. For some embodiments, the number of memory cells in aserially-coupled string of memory cells may be some power of 2, such as8, 16, 32, 64, etc.

A source select transistor 216 is coupled to each serially-coupledstring of memory cells through a conductive pillar 214, and a drainselect transistor 280 is coupled to each serially-coupled string ofmemory cells through a conductive pillar 270, as shown in FIG. 2C. Eachsource select transistor 216 selectively couples the lower end of eachconductive pillar 230 and thus the serially-coupled string of memorycells on either side of that conductive pillar 230 to source line 200,as shown in FIG. 2C. Each drain select transistor 280 selectivelycouples the upper end of each conductive pillar 230 and thus theserially-coupled string of memory cells on either side of thatconductive pillar 230 to a bit line 290.

CONCLUSION

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe embodiments will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the embodiments. It is manifestly intended that theembodiments be limited only by the following claims and equivalentsthereof.

What is claimed is:
 1. A system, comprising: a processor; and a memorydevice in communication with the processor, wherein the memory devicecomprises an array of non-volatile memory cells configured in a NANDarchitecture, the array of non-volatile memory cells comprising: aplurality of series-coupled first non-volatile memory cells, each firstnon-volatile memory cell of the plurality of series-coupled firstnon-volatile memory cells curving around a first curved side of asubstantially vertical pillar and terminating at a first isolationregion in contact with the substantially vertical pillar and at a secondisolation region in contact with the substantially vertical pillar,wherein the substantially vertical pillar is between the first isolationregion and the second isolation region; a plurality of series-coupledsecond non-volatile memory cells, different than the plurality ofseries-coupled first non-volatile memory cells, each second non-volatilememory cell of the plurality of series-coupled second non-volatilememory cells curving around a second curved side of the substantiallyvertical pillar and terminating at the first isolation region and at thesecond isolation region, wherein the first isolation region and thesecond isolation region are each between the plurality of series-coupledfirst non-volatile memory cells and the plurality of series-coupledsecond non-volatile memory cells; wherein respective ones of the firstnon-volatile memory cells of the plurality of series-coupled firstnon-volatile memory cells are respectively at same vertical levels asrespective ones of the second non-volatile memory cells of the pluralityof series-coupled second non-volatile memory cells.
 2. The system ofclaim 1, wherein the array of non-volatile memory cells furthercomprises a select transistor that selectively couples the plurality ofseries-coupled first non-volatile memory cells and the plurality ofseries-coupled second non-volatile memory cells to a source.
 3. Thesystem of claim 2, wherein the select transistor comprises a channelthat is coupled to the substantially vertical pillar and the source. 4.The system of claim 1, wherein the array of non-volatile memory cellsfurther comprises a select transistor that selectively couples theplurality of series-coupled first non-volatile memory cells and theplurality of series-coupled second non-volatile memory cells to a dataline.
 5. The system of claim 4, wherein the select transistor comprisesa channel that is coupled to the substantially vertical pillar and thedata line.
 6. The system of claim 1, wherein the substantially verticalpillar comprises a semiconductor.
 7. The system of claim 1, wherein eachof the plurality of series-coupled first non-volatile memory cells andeach of the plurality of series-coupled second non-volatile memory cellsis a semiconductor-oxide-nitride-oxide-semiconductor memory cell.
 8. Thesystem of claim 1, wherein the array of non-volatile memory cellsconfigured in a NAND architecture comprises an array of non-volatilememory cells configured in a three-dimensional NAND architecture.
 9. Asystem, comprising: a processor; and a memory device in communicationwith the processor, wherein the memory device comprises an array ofnon-volatile memory cells configured in a NAND architecture, the arrayof non-volatile memory cells comprising: a conductive pillar; aplurality of first non-volatile memory cells on a first side of theconductive pillar coupled in series by the conductive pillar, each firstnon-volatile memory cell of the plurality of first non-volatile memorycells comprising a respective portion of the first side of theconductive pillar, a respective portion of a first charge trap adjacentto the first side of conductive pillar and a respective first controlgate adjacent to the respective portion of the first charge trap; aplurality of second non-volatile memory cells on a second side of theconductive pillar, opposite to the first side of the conductive pillar,coupled in series by the conductive pillar, each second non-volatilememory cell of the plurality of second non-volatile memory cellscomprising a respective portion of the second side of the conductivepillar, a respective portion of a second charge trap adjacent to thesecond side of the conductive pillar and a respective second controlgate adjacent to the respective portion of the second charge trap; and asingle select transistor that selectively couples the plurality of firstnon-volatile memory cells and the plurality of second non-volatilememory cells to one of a source line and a data line; wherein each firstcontrol gate of the plurality of first non-volatile memory cells iselectrically isolated from each second control gate of the plurality ofsecond non-volatile memory cells; and wherein respective ones of thefirst non-volatile memory cells of the plurality of first non-volatilememory cells are respectively at same vertical levels as respective onesof the second non-volatile memory cells of the plurality of secondnon-volatile memory cells.
 10. The system of claim 9, wherein each firstcharge trap of the plurality of first non-volatile memory cells iselectrically isolated from each second charge trap of the plurality ofsecond non-volatile memory cells.
 11. The system of claim 9, wherein theconductive pillar is a first conductive pillar, and wherein the singleselect transistor is adjacent to a second conductive pillar coupled tothe first conductive pillar.
 12. The system of claim 9, wherein theconductive pillar forms a channel for both the plurality of firstnon-volatile memory cells and the plurality of second non-volatilememory cells.
 13. A system, comprising: a processor; and a memory devicein communication with the processor, wherein the memory device comprisesan array of non-volatile memory cells configured in a NAND architecture,the array of non-volatile memory cells comprising: a first pair ofelectrically isolated activation lines formed on opposing sides of oneor more conductive pillars, wherein a first one of the first pair ofelectrically isolated activation lines is electrically isolated from asecond one of the first pair of electrically isolated activation lines;a second pair of electrically isolated activation lines formed onopposing sides of the one or more conductive pillars, wherein a firstone of the second pair of electrically isolated activation lines iselectrically isolated from a second one of the second pair ofelectrically isolated activation lines; and a plurality of chargestorage nodes, wherein each charge storage node of the plurality ofcharge storage nodes is interposed between a respective conductivepillar of the one or more conductive pillars and a respective activationline of first pair of electrically isolated activation lines or thesecond pair of electrically isolated activation lines; wherein anon-volatile memory cell formed at an intersection of the first one ofthe first pair of electrically isolated activation lines and a given oneof the conductive pillars, and a non-volatile memory cell formed at anintersection of the first one of the second pair of electricallyisolated activation lines and the given one of the conductive pillars,form at least a portion of a first serially-coupled string ofnon-volatile memory cells comprising a first portion of the given one ofthe conductive pillars; wherein a non-volatile memory cell formed at anintersection of the second one of the first pair of electricallyisolated activation lines and the given one of the conductive pillars,and a non-volatile memory cell formed at an intersection of the secondone of the second pair of electrically isolated activation lines and thegiven one of the conductive pillars, form at least a portion of a secondserially-coupled string of non-volatile memory cells comprising a secondportion of the given one of the conductive pillars; and wherein thefirst one of the first pair of electrically isolated activation linesand the first one of the second pair of electrically isolated activationlines are formed on the same side of the given one of the conductivepillars.
 14. The system of claim 13, further comprising a first selecttransistor coupled to a first end of the first serially-coupled stringof non-volatile memory cells and a first end of the secondserially-coupled string of non-volatile memory cells.
 15. The system ofclaim 14, wherein the one or more conductive pillars are one or morefirst conductive pillars, wherein the first select transistor is formedat an intersection between a select line and a second conductive pillarcoupled to an end of the given one of the first conductive pillars. 16.The system of claim 15, wherein second conductive pillar is furthercoupled to a source line.
 17. The system of claim 14 further comprises asecond select transistor coupled to a second end of the firstserially-coupled string of non-volatile memory cells and a second end ofthe second serially-coupled string of non-volatile memory cells.
 18. Thesystem of claim 17, wherein the one or more conductive pillars are oneor more first conductive pillars, wherein the second select transistoris formed at an intersection between a select line and a secondconductive pillar coupled to a second end of the given one of the firstconductive pillars.
 19. The system of claim 18, wherein secondconductive pillar is further coupled to a data line.
 20. The system ofclaim 17, wherein the first select transistor selectively couples thefirst serially-coupled string of non-volatile memory cells and thesecond serially-coupled string of non-volatile memory cells to a sourceline and the second select transistor selectively couples the firstserially-coupled string of non-volatile memory cells and the secondserially-coupled string of non-volatile memory cells to a data line. 21.The system of claim 13, further comprising an isolation regioninterposed between the first and second ones of the first and secondpairs of electrically isolated activation lines.
 22. The system of claim21, wherein the isolation region extends between the charge storage nodeinterposed between the first one of the first pair of electricallyisolated activation lines and the given one of the conductive pillarsand the charge storage node interposed between the second one of thefirst pair of electrically isolated activation lines and the given oneof the conductive pillars.
 23. The system of claim 22, wherein theisolation region further extends between the charge storage nodeinterposed between the first one of the second pair of electricallyisolated activation lines and the given one of the conductive pillarsand the charge storage node interposed between the second one of thesecond pair of electrically isolated activation lines and the given oneof the conductive pillars.